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Yayu'an UV laser machine
发布者：煜安工业品（苏州）有限公司 发布时间：2020-1-16 10:36:35 点击次数：250 关闭
The UV laser marking machine belongs to the series of laser marking machines, but it is developed by using a 355nm UV laser. This machine uses a third-order intra-cavity frequency doubling technology compared with infrared lasers. The mechanical deformation of the material is greatly reduced and the thermal impact of processing is small, because it is mainly used for ultra-fine marking and engraving, especially suitable for food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and silicon. Wafers for complex pattern cutting applications.
Advantage:
Ultraviolet laser has a very small focusing spot and a small heat-affected zone, so it can perform ultra-fine marking and special material marking, which is the product of choice for customers who have higher requirements on the marking effect. In addition to copper materials, UV lasers are more suitable for processing. Not only good beam quality, smaller focusing spot, can achieve ultra-fine marking; wider range of application; extremely small heat affected area, no thermal effect, no material scorching problem; fast marking speed, high efficiency; overall performance Stability, small size, low power consumption, etc.
Model distinction:
Ultraviolet lasers are mainly based on low power. The power of their series products mainly includes ML-W1.5, ML-w3, ML-w5, ML-w8, ML-w10 and other series. Their power is mainly customized according to the requirements of processing materials. There is a great correlation between machining effects and power.
Application:
The UV laser marking machine is mainly based on its unique low-power laser beam, which is especially suitable for high-end markets for ultra-fine processing. The surface of packaging bottles for cosmetics, pharmaceuticals, food and other polymer materials has a fine effect, and the marking is clear and firm. Better than ink coding and no pollution; flexible pcb board marking and dicing; micro wafers, blind hole processing of silicon wafers; LCD liquid crystal glass two-dimensional code marking, glass appliance surface drilling, metal surface plating marking, Plastic buttons, electronic components, gifts, communication equipment, construction materials, etc.
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